发明名称 Wireless bus for intra-chip and inter-chip communication, including wireless-enabled component (WEC) embodiments
摘要 Embodiments of the present invention are directed to a wireless-enabled component (WEC) for enabling a wireless bus for intra-chip and inter-chip communication. A WEC encompasses a functional block of an IC (such as, for example, a processing core of a processing unit), an entire IC (such as, for example, a processing unit), or a device that includes a plurality of ICs (such as, for example, a handheld device). According to embodiments, a WEC may be associated with one or more sub-blocks of an IC, a single IC, or a plurality of ICs.
申请公布号 US9008589(B2) 申请公布日期 2015.04.14
申请号 US201012877706 申请日期 2010.09.08
申请人 Broadcom Corporation 发明人 Rofougaran Ahmadreza (Reza);Behzad Arya Reza;Zhao Sam Ziqun;Castaneda Jesus Alfonso;Boers Michael
分类号 H04B1/38;G06F13/42;H04B7/10;G06F13/364;H04W84/18 主分类号 H04B1/38
代理机构 Sterne, Kessler, Goldstein & Fox P.L.L.C. 代理人 Sterne, Kessler, Goldstein & Fox P.L.L.C.
主权项 1. A wireless-enabled component (WEC), comprising: a core module configured to perform one or more functions of the WEC; a wireless transceiver, coupled via an interface to the core module, configured to transmit or receive a data signal wirelessly to or from another WEC; a power interface configured to receive a modulated power signal, distinct from the data signal, from an external source and to provide power to the core module and the wireless transceiver; and a demodulator, coupled to the power interface, configured to demodulate the modulated power signal to generate configuration information and to provide the configuration information to the wireless transceiver and the core module.
地址 Irvine CA US
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