| 发明名称 | Method of manufacturing ceramic electronic component, ceramic electronic component, and wiring board | ||
| 摘要 | A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired. | ||
| 申请公布号 | US9007161(B2) | 申请公布日期 | 2015.04.14 |
| 申请号 | US201414339506 | 申请日期 | 2014.07.24 |
| 申请人 | Murata Manufacturing Co. Ltd. | 发明人 | Sato Koji;Sanada Yukio;Nishisaka Yasuhiro |
| 分类号 | H05K1/18;H01C1/14;H01C7/00;H01C7/02;H01G2/06;H01G4/228;H01F27/28;H01G4/008;H01G4/12;H01L41/083;H05K3/32 | 主分类号 | H05K1/18 |
| 代理机构 | Keating & Bennett, LLP | 代理人 | Keating & Bennett, LLP |
| 主权项 | 1. A ceramic electronic component comprising: a substantially rectangular parallelepiped-shaped ceramic body including mutually facing first and second main surfaces extending in a length direction and a width direction, mutually facing first and second side surfaces extending in the length direction and a thickness direction, and mutually facing first and second end surfaces extending in the width direction and the thickness direction, and having a length dimension L, a width dimension W, and a thickness dimension T satisfying relationships of T≦W<L, about ⅕ W≦T≦about ½ W, and T≦about 0.3 mm; first and second internal electrodes located inside the ceramic body to at least partially face each other in the thickness direction; a first external electrode located on an end portion of the first main surface on one side in the length direction, and electrically connected to the first internal electrode; and a second external electrode located on an end portion of the first main surface on the other side in the length direction, and electrically connected to the second internal electrode; wherein when a plane passes through a portion of the first main surface corresponding to a location of an end portion of the first external electrode on the other side in the length direction and a portion of the first main surface corresponding to a location of an end portion of the second external electrode on the one side in the length direction, a distance between the plane and a portion of the first main surface most distant from the plane is about 4.9 μm or less. | ||
| 地址 | Kyoto JP | ||