Apparatuses and methods for seaming substrates

摘要

A method of joining substrate portions includes positioning the substrate portions such that the substrate portions overlap at an overlap area. The substrate portions each have a melting temperature and an outer surface. A fluid is heated to a temperature sufficient to at least partially melt the substrate portions. A jet of the heated fluid is directed from a fluid orifice onto the substrate portions at the overlap area. The heated fluid penetrates at least one of the outer surfaces of the substrate portions. The substrate portions are at least partially melted using the heated fluid. The substrate portions are compressed using a pressure applying surface adjacent the fluid orifice to join the substrate portions together at the overlap area.

主权项

1. A method for forming a seam, the method comprising the steps of:
rotating a forming cylinder about an axis of rotation, the forming cylinder comprising a fluid orifice, a pressure applying member extending radially outward from the forming cylinder, and a fluid outlet extending through the pressure applying member; rotating an anvil cylinder adjacent the forming cylinder; advancing a first substrate in a machine direction on the forming cylinder with a separation distance Y between the fluid orifice and the first substrate; advancing a second substrate in the machine direction wherein the first substrate is between the second substrate and the forming cylinder; maintaining the separation distance between the first substrate and the fluid orifice with the pressure applying member; heating a fluid to a temperature sufficient to at least partially melt the substrates; directing a jet of the heated fluid through the fluid orifice and onto an overlap area of the first and second substrates; partially melting the overlap area; and compressing the overlap area in a nip between the pressure applying member and the anvil cylinder.