| 摘要 |
<p>The present invention relates to a chip component. According to an embodiment of the present invention, the chip component comprises: a magnetic substrate with ferrite layers; an insulation shield set on the magnetic substrate wherein an electrode is placed; and an external electrode connected to the magnetic pole on the insulation shield while an interface of the magnetic substrate and the insulation shield may have a chemical combination structure including Si-O-C or Si-O-N.</p> |
