Ultra-thin sensing device with flat contact surface

摘要

An ultra-thin sensing device with a flat contact surface comprises a package substrate, an interposer structure, a vertical electrical connection structure and a sensing chip. The interposer structure disposed on the package substrate comprises connection pads and second bonding pads electrically connected to the connection pads and first bonding pads of the package substrate. The vertical electrical connection structure disposed on the interposer structure comprises vertical conductors electrically connected to the connection pads. The sensing chip disposed on the vertical electrical connection structure comprises a chip substrate, and sensing members, sensing circuit cells and vertical through electrodes, which are formed on the chip substrate. The sensing member senses specific features of an organism to obtain sensing signals, processed by the sensing circuit cells into biometrics feature signals transmitted to the first bonding pad through the vertical through electrode, the vertical conductor and the second bonding pad.

主权项

1. An ultra-thin sensing device with a flat contact surface, the sensing device comprising:
a package substrate comprising first bonding pads; an interposer structure, which is disposed on the package substrate and comprises connection pads and second bonding pads electrically connected to the first bonding pads and the connection pads; a vertical electrical connection structure, which is disposed on the interposer structure and comprises vertical conductors electrically connected to the connection pads; and a sensing chip, which is disposed on the vertical electrical connection structure and comprises a chip substrate, and sensing members, sensing circuit cells and vertical through electrodes, wherein the sensing members, the sensing circuit cells and the vertical through electrodes are formed on the chip substrate, wherein: the sensing members constituting a sensing member array sense specific features of an organism to obtain sensing signals; the sensing circuit cells, constituting a sensing circuit cell array and electrically connected to the sensing members, process the sensing signals into biometrics feature signals; and the vertical through electrodes are directly or indirectly electrically connected to the sensing circuit cells and the vertical conductors, so that the biometrics feature signals are transmitted to the first bonding pads through the vertical through electrodes, the vertical conductors and the second bonding pads, respectively.