| 发明名称 | Semiconductor device | ||
| 摘要 | An aspect of the present embodiment, there is provided a semiconductor device, including an insulating substrate, at least one semiconductor chip provided above the insulating substrate, a wiring terminal including a connection portion electrically connected to the semiconductor chip, a surrounding frame surrounding the semiconductor chip and the connection portion, an embedded material provided in the surrounding frame covering the semiconductor chip and the connection portion, and a pressing unit provided on a surface of the embedded material. | ||
| 申请公布号 | US9006881(B2) | 申请公布日期 | 2015.04.14 |
| 申请号 | US201314019087 | 申请日期 | 2013.09.05 |
| 申请人 | Kabushiki Kaisha Toshiba | 发明人 | Fukuyoshi Hiroshi;Nakao Junichi;Endo Yoshiki;Miyake Eitaro |
| 分类号 | H01L23/34;H01L23/00 | 主分类号 | H01L23/34 |
| 代理机构 | White & Case LLP | 代理人 | White & Case LLP |
| 主权项 | 1. A semiconductor device, comprising: an insulating substrate; at least one semiconductor chip provided above the insulating substrate; a wiring terminal including a connection portion electrically connected to the semiconductor chip; a surrounding frame surrounding the semiconductor chip and the connection portion; an embedded material provided in the surrounding frame covering the semiconductor chip and the connection portion; a pressing unit provided on a surface of the embedded material; and a housing covering the insulating substrate and comprising the pressing unit. | ||
| 地址 | Tokyo JP | ||