Post-mold for semiconductor package having exposed traces

摘要

Method of and devices for protecting semiconductor packages are provided. The methods and devices comprise loading a leadframe containing multiple semiconductor packages into a molding device, adding a molding material on a surface of the leadframe, molding the molding material, such that the molding material covers the entire surface of the semiconductor packages except conducting terminals, and singulating the semiconductor packages from the leadframe after molding the molding material.

主权项

1. A method of forming a protective layer on partially molded semiconductor packages comprising:
a. adding a molding material on a surface of the semiconductor packages on a leadframe; b. selectively covering a first conductive member with the molding material by using a molding device, such that the first conductive member becomes a protected first conductive member; c. preventing the molding material from covering at least one conductive terminal by making a contact of a mold chase with a bottom side of the at least one conductive terminal while the molding material is applied to one or more cavities between the mold chase and the first conductive member; and d. forming a protective surface covering substantial all of the surface of the semiconductor packages.