| 主权项 |
1. A method for forming a pattern in a polymeric layer, the method comprising:
providing a polymeric layer comprising a reactive composition that comprises:
(a) a reactive polymer comprising -A-recurring units comprising pendant tertiary alkyl ester groups in an amount of at least 25 mol %, based on total (a) reactive polymer recurring units,(b) a compound that provides an acid upon exposure to radiation having a λmax of at least 150 nm and up to and including 450 nm, which acid has a pKa of less than 2 as measured in water,(c) a crosslinking agent that is capable of reacting in the presence of the acid provided by the (b) compound to provide crosslinking in the (a) reactive polymer, and(d) optionally, a photosensitizer, patternwise exposing the polymeric layer to radiation having a λmax of at least 150 nm and up to and including 450 nm, to provide a polymeric layer comprising non-exposed regions and first exposed regions comprising a polymer comprising carboxylic acid groups, optionally heating the polymeric layer simultaneously with or after patternwise exposing the polymeric layer but before contacting the first exposed regions of the polymeric layer with electroless seed metal ions at a temperature sufficient to generate pendant carboxylic acid groups in the (a) reactive polymer in the first exposed regions of the polymeric layer, contacting the first exposed regions of the polymeric layer with electroless seed metal ions to form electroless seed metal ions in the first exposed regions of the polymeric layer, contacting the first exposed regions of the polymeric layer with a halide to react with the electroless seed metal ions and to form corresponding electroless seed metal halide in the first exposed regions of the polymeric layer, exposing the polymeric layer to convert at least some of the corresponding electroless seed metal halide in the first exposed regions of the polymeric layer to corresponding electroless seed metal nuclei and to form second exposed regions in the polymeric layer, optionally contacting the polymeric layer with a reducing agent either: (i) to develop the corresponding electroless seed metal image in the second exposed regions of the polymeric layer to form corresponding electroless seed metal nuclei, or (ii) to develop all of the corresponding electroless seed metal halide in the first exposed regions of the polymeric layer, optionally contacting the polymeric layer with a fixing agent to remove any remaining corresponding electroless seed metal halide in either the first exposed regions of the polymeric layer, the second exposed regions of the polymeric layer, or both of the first exposed regions and the second exposed regions of the polymeric layer, and electrolessly plating the corresponding electroless seed metal nuclei in the first exposed regions, any corresponding electroless seed metal nuclei formed in the second exposed regions, or corresponding electroless seed metal nuclei in both the first exposed regions and the second exposed regions, of the polymeric layer, with a metal that is the same as or different from the corresponding electroless seed metal nuclei. |
