发明名称 Radiation induced diode structure
摘要 A semiconductor device containing an NPN bipolar junction transistor may be formed by forming a p-type radiation induced diode structure (RIDS) region in an intrinsic p-type base region of the NPN bipolar junction transistor at a boundary of the intrinsic p-type base region with a dielectric layer over a substrate of the semiconductor device, between an emitter of the NPN bipolar junction transistor and an extrinsic p-type base region of the NPN bipolar junction transistor. The p-type RIDS region has a doping density high enough to prevent inversion of a surface of the p-type RIDS region adjacent to the dielectric layer when trapped charge is accumulated in the dielectric layer, while the intrinsic p-type base region may invert from the trapped charge forming the radiation induced diode structure. The p-type RIDS region is separated from the emitter and from the extrinsic base region by portions of the intrinsic base region.
申请公布号 US9006864(B2) 申请公布日期 2015.04.14
申请号 US201314073777 申请日期 2013.11.06
申请人 Texas Instruments Incorporated 发明人 Salzman James Fred;Roybal Richard Guerra;Kahn Randolph William
分类号 H01L29/73;H01L21/265;H01L29/66;H01L29/732;H01L29/06 主分类号 H01L29/73
代理机构 代理人 Garner Jacqueline J.;Cimino Frank
主权项 1. A semiconductor device, comprising: a substrate comprising semiconductor material; a dielectric layer over said substrate; an NPN bipolar junction transistor, comprising: an n-type emitter in said substrate, said n-type emitter extending up to said dielectric layer;a p-type extrinsic base region in said substrate, said p-type extrinsic base region extending up to said dielectric layer, said p-type extrinsic base regions being laterally separated from said n-type emitter;a p-type intrinsic base region in said substrate, said p-type intrinsic base region abutting said n-type emitter and extending up to said dielectric layer between said n-type emitter and said p-type extrinsic base region, said dielectric layer being at least 50 nanometers thick over said p-type intrinsic base region between said n-type emitter and said p-type extrinsic base region; anda p-type radiation induced diode structure (RIDS) region in said substrate, said p-type RIDS region extending up to said dielectric layer between said n-type emitter and said p-type extrinsic base region, said p-type RIDS region being laterally separated from said p-type extrinsic base region and from said n-type emitter, said p-type RIDS region having an average doping density greater than 5 times and average doping density of said p-type intrinsic base region.
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