Wireless devices including printed integrated circuitry and methods for manufacturing and using the same

摘要

Printed integrated circuitry and attached antenna and/or inductor for sensors, electronic article surveillance (EAS), radio frequency (RF) and/or RF identification (RFID) tags and devices, and methods for its manufacture. The tag generally includes printed integrated circuitry on one carrier and an antenna and/or inductor on another carrier, the integrated circuitry being electrically coupled to the antenna and/or inductor. The method of manufacture generally includes of printing an integrated circuit having a plurality of first pads on a carrier, forming an antenna and/or inductor having a plurality of second pads on a substrate, and attaching at least two of the first pads of the printed integrated circuit to corresponding second pads of the antenna and/or inductor. The present invention advantageously provides a low cost RFID tag capable of operating at MHz frequencies that can be manufactured in a shorter time period than conventional RFID tags that manufacture all active electrical devices on a conventional wafer.

主权项

1. An identification device, comprising:
a) printed integrated circuitry on a first substrate, the printed integrated circuitry comprising a plurality of electrically active devices, the plurality of electrically active devices including a plurality of thin films, the plurality of thin films comprising a lowest layer in physical contact with a surface of said first substrate, a first successive layer on the lowest layer, and a second successive layer on the first successive layer, wherein the lowest layer and the first and second successive layers taken together comprise an insulating thin film, a metal thin film, and a semiconductor thin film and at least one of the lowest layer and the first and second successive layers is a printed thin film; b) first and second pads on the first substrate and/or the printed integrated circuitry, the first and second pads electrically connected to the printed integrated circuitry, at first and second locations, respectively; and c) a single-layer antenna and/or inductor on a second substrate consisting essentially of a conductive line having a first and second ends thereon, the first and second ends being physically connected to the first and second pads, respectively.