发明名称 SURFACE-TREATED ROLLED COPPER FOIL, LAMINATE, PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING PRINTED WIRING BOARD
摘要 <p>The present invention provides a surface-treated rolled copper foil that attaches well to resin with excellent etching capacity and flexibility and a superior transparency of resin after the cooper foil is removed by etching. The surface-treated rolled copper foil has the surface of at least one side and/or the surface of both sides that satisfies 2.5 <= I{110}/I{112} <= 6.0, and the surface treatment is done on the surface of at least one side and/or the surface on both sides. Also, in the surface-treated rolled copper foil and a copper clad laminate made by laminating a polyimide with the belowΔB (PI) before attaching to the copper foil of 50 or higher and 65 or lower, the chrominance (ΔE*ab) based on JIS Z 8730 on the surface beyond the polyimide becomes 50 or higher. The Sv defined by the below Formula (1) of the surface-treated rolled copper foil becomes 3.0 or higher when, after it is bound to both sides of polyimide resin substrate from the surface side where surface treatment is done, the rolled copper foil on both sides is removed by etching, a printed matter is placed at the bottom of the polyimide substrate, and a photo is taken by a CCD camera beyond the polyimide substrate. Formula (1): Sv = (ΔB×0.1)/(t1 - t2).</p>
申请公布号 KR20150040235(A) 申请公布日期 2015.04.14
申请号 KR20140133425 申请日期 2014.10.02
申请人 发明人
分类号 B32B15/08;C25D7/06;H05K1/09 主分类号 B32B15/08
代理机构 代理人
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