Method of manufacturing resin molded electronic component

摘要

A method of manufacturing a resin molded electronic component using a first mold having a cavity with an open top surface and a second mold combined with the first mold on top includes the following steps: (A) inserting a element of the electronic component and a liquid resin precursor into the cavity of the first mold, the liquid resin precursor having viscosity of 10 Pa·s or lower at 40° C.; (B) arranging the second mold such that the element and the resin precursor are sandwiched after the step (A); and (C) pressing the element and the resin precursor between the first mold and the second mold, and curing the resin precursor by heat from the second mold after the step (B). A temperature of the second mold is set to be higher than that of the first mold.

主权项

1. A method of manufacturing a resin molded electronic component using a mold comprising upper and lower sections, the lower mold having a cavity with an open top, the method comprising:
inserting an electronic component element and a liquid resin precursor including a norbornene monomer into the lower mold cavity, the lower mold being heated to between 40° C. and 60° C., inclusive and the resin precursor having a viscosity of 10 Pa·s or lower at 40° C.; arranging the upper mold so as to sandwich the inserted element and resin precursor within the lower mold cavity, the arranged upper mold being heated to between 80° C. and 120° C., inclusive so as to initiate curing of the resin precursor progressing from the arranged upper mold, and the lower mold remaining heated to between 40° C. and 60°, inclusive during said arranging and curing; and pressing the sandwiched element and resin precursor between the upper and lower molds during said curing.