| 摘要 |
PROBLEM TO BE SOLVED: To provide a component packaging inspection device for accurately detecting a component packaging defect that may cause component floating, by inspecting a contact state between a solder and a component.SOLUTION: A post-printing extraction/prediction part 2 for each inspection component extracts a height 1a2 of a solder printed on a pad for packaging an attention target packaging component from a paste measurement result 1a of output from a post-printing appearance inspection machine 1, calculates a component height prediction 2a for each packaging component by using the measured solder height 1a2, an intrusion amount Pm in a component packaging step relating to the target packaging component, and height information Hs in a packaging direction (namely, thickness information of the target packaging component) and outputs the component height prediction 2a to a post-component-packaging inspection determination part 4. On the basis of a result of comparing a differential value between the component height prediction 2a for each packaging component and a height 3a of the packaging component measured in the post-component-packaging appearance inspection machine 3 with a predetermined threshold value, the post-component-packaging inspection determination part 4 determines a quality for a packaging state of the packaged target packaging component. |
