| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a lead frame capable of preventing occurrence of cracking, due to influence of thermal expansion and contraction, at a solder portion for connecting an external terminal arranged near the corner of a die pad and an external mounting board, and to provide a manufacturing method therefor, a semiconductor device, and a manufacturing method therefor.SOLUTION: A lead frame 10 includes a rectangular die pad 15 for mounting a semiconductor element, and a plurality of long leads 16A and a plurality of short leads 16B provided around the die pad 15. The plurality of long leads 16A and plurality of short leads 16B are arranged along the side 15a of the die pad 15. Near the end of the side 15a of the die pad 15, a pair of short leads 16B are arranged adjacently, and the pair of short leads 16B are interconnected by a connection body 28 located in a region 14 corresponding to a semiconductor device.</p> |
