发明名称 HOUSING AND ELECTRIC DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To achieve downsizing of a housing, in which a heating element is stored, while reducing the manufacturing costs of the housing.SOLUTION: A housing includes: a first case which stores a first heating element therein, the first case in which a heat sink which emits heat generated from the first heating element to the exterior is disposed in a first region of an outer surface; and a second case which stores a second heating element therein and is fixed to a second region of the outer surface, which is different from the first region. Heat conductivity of the first case may be lower than heat conductivity of the second case.</p>
申请公布号 JP2015070254(A) 申请公布日期 2015.04.13
申请号 JP20130206483 申请日期 2013.10.01
申请人 OMRON CORP 发明人 TAKAGI HIROTO;AKAMOTO KEIGO;NAMBA HARUYUKI;OYA TATSUYA;IWATA MITSUO
分类号 H05K7/20 主分类号 H05K7/20
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