RESIN SHEET AND MANUFACTURING METHOD OF ELECTRONIC DEVICE PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a resin sheet for sealing an electronic device which easily positions the resin sheet and prevents misalignment when the resin sheet is placed on the electronic device, and to provide a manufacturing method of an electronic device package.SOLUTION: The invention relates to a resin sheet for sealing an electronic device which includes a flat part and a protruding part protruding from the flat part in a thickness direction.