发明名称 |
ADHESIVE TRANSFER DEVICE AND ADHESIVE TRANSFER METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive transfer device and adhesive transfer method which make it possible to obtain a bump according to a component.SOLUTION: An adhesive transfer device comprises transfer means that transfers an adhesive adhering to a rod-like member to an adherend, and temperature control means that, according to a component mounted on the transferred adhesive, controls the individual temperatures of the rod-like member and the adherend upon the transfer. |
申请公布号 |
JP2015066545(A) |
申请公布日期 |
2015.04.13 |
申请号 |
JP20130206392 |
申请日期 |
2013.10.01 |
申请人 |
FUJITSU LTD |
发明人 |
HOKARI MAMORU;ABE TAKAYUKI;SAKAI SATORU;OKADA HIDEO;MARUYAMA KAZUNORI;INOTANI NOBUHIKO;NISHIYAMA YOJI |
分类号 |
B05C1/02;B05D1/28;B05D7/24;C09J5/06;C09J201/00 |
主分类号 |
B05C1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|