发明名称 ADHESIVE TRANSFER DEVICE AND ADHESIVE TRANSFER METHOD
摘要 PROBLEM TO BE SOLVED: To provide an adhesive transfer device and adhesive transfer method which make it possible to obtain a bump according to a component.SOLUTION: An adhesive transfer device comprises transfer means that transfers an adhesive adhering to a rod-like member to an adherend, and temperature control means that, according to a component mounted on the transferred adhesive, controls the individual temperatures of the rod-like member and the adherend upon the transfer.
申请公布号 JP2015066545(A) 申请公布日期 2015.04.13
申请号 JP20130206392 申请日期 2013.10.01
申请人 FUJITSU LTD 发明人 HOKARI MAMORU;ABE TAKAYUKI;SAKAI SATORU;OKADA HIDEO;MARUYAMA KAZUNORI;INOTANI NOBUHIKO;NISHIYAMA YOJI
分类号 B05C1/02;B05D1/28;B05D7/24;C09J5/06;C09J201/00 主分类号 B05C1/02
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