| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component including a layer that shows a high cross-sectional shape closer to rectangle and is made of a functional material such as a conductor or an insulator, by use of exposure technology.SOLUTION: An antireflection film 12 is formed on a substrate 11. The antireflection film 12 is applied so as to prevent reflection and scattering of undesirable light on a surface of the substrate 11 in an exposure process. A photosensitive functional material paste is applied on the antireflection film 12 to form a functional material paste layer 13a. The functional material paste layer 13a is exposed and developed to form a functional material layer 13 having a predetermined pattern. The antireflection film 12 is configured to have a lower transmittance for h-line compared to that of the functional material paste layer 13a in the same film thickness so as to sufficiently absorb light 15 incident to the functional material paste layer 13a in an exposure process, and for example, the antireflection film has a transmittance of 1.3% or less for h-line in a film thickness of 20 μm. |
