| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which satisfy both of downsizing and improvement in reliability of the semiconductor device at low cost.SOLUTION: A semiconductor device according to the present embodiment comprises: a ceramic board 1; a plurality of circuit patterns 1a arranged on a surface of the ceramic board 1; a semiconductor element 2 arranged on a surface of at least one circuit pattern 1a; and an encapsulation resin 4 for encapsulating the ceramic board 1, the plurality of circuit patterns 1a and the semiconductor element 2. The semiconductor device further comprises undercut parts 1aa formed on opposed lateral faces of the adjacent circuit patterns 1a. At the undercut parts 1aa, an end 11 of each surface of the circuit patterns 1a projects outward from an end 12 of each plane of the circuit pattern 1a, which contacts the ceramic board 1, and the encapsulation resin 4 also fills the under cut parts 1aa. |
