| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a junction assembly apparatus capable of obtaining a joined body in which bubbles are less in a solder joint layer, by joining a laminate of at least one joined member and at least one solder material by short time soldering.SOLUTION: A junction assembly apparatus includes in a vacuum oven 11 a metal wire 12, a conveyance stage 13 supporting a laminate 10 of at least one joined member and at least one solder material, and movable in the horizontal direction and the vertical direction, a cooling plate 15 for cooling the laminate via the conveyance stage, a hot plate 16 for heating the laminate via the conveyance stage, an active species gas introduction pipe 17, an inert gas introduction pipe 18, and an exhaust port 113, and further includes on the outside of the oven an AC or DC power supply (not shown) that is heating means for heating the metal wire by electrifying.</p> |
