| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electronic component manufacturing method in which depositing and remaining of a foreign substance on a cutting surface upon dicing can be suppressed, and, by means of this, a yield rate can be improved.SOLUTION: The electronic component manufacturing method based on the present invention comprises a process in which a work piece 20 that is a material of electronic components is adhesively-held by an adhesive sheet 30, and a process in which the workpiece 20 adhesively-held by the adhesive sheet 30 is divided by cutting the workpiece 20 with using a dicing blade 120. In the process of dividing the workpiece 20, cutting water A is sprayed toward a processing point of the workpiece 20, and the dicing blade 120 is made to approach to the workpiece 20 so as to reach the adhesive sheet 30. In this place, water a to which a cleaning agent b and an anti-foaming agent c are added is used as the cutting water A.</p> |
