| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a technology which suppresses spreading of excess process liquid supplied to a surface peripheral part, to a center side of a substrate.SOLUTION: A substrate processing apparatus 1 comprises: a substrate holding part (for example, a spin chuck 2) for rotating a substrate 9 around a vertical rotary shaft passing through a center of its surface, while holding the substrate 9 in a horizontal attitude; and a processing head 51 for a peripheral part, for processing a surface peripheral part 911 of the substrate 9 held by the spin chuck 2. The processing head 51 for the peripheral part comprises: a process liquid nozzle (for example, a first chemical nozzle 501a) for discharging the process liquid toward the surface peripheral part 911; and a suction tube (for example, a first suction tube 502a) for corresponding to the process liquid nozzle and sucking excess process liquid on the surface peripheral part 911.</p> |
