CURABLE RESIN COMPOSITION, HARDENED PRODUCT, ELECTRICAL AND ELECTRONIC PARTS AND CIRCUIT BOARD MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a curable resin composition which has good dielectric characteristics, e.g. a low dielectric constant and a low dielectric tangent, even after severe thermal hysteresis, gives a hardened product having high adhesion reliability and is usable as a dielectric material, an insulation material and a heat-resistant material in fields, e.g. electrical and electronic industries and space and aviation industries and its production method and hardened product.SOLUTION: A curable resin composition comprises (A) a poly(vinylbenzyl) ether compound having vinyl benzyl ether groups and obtained by reacting a naphthol aralkyl resin with a vinyl aromatic halomethyl compound, (B) a cyanate resin and (C) a metal hardening catalyst.