发明名称 MANUFACTURING METHOD AND HEAT MANAGEMENT METHOD OF COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method and a heat management method of a component in which a cooling function is formed.SOLUTION: A manufacturing method and a heat management method of a component include forming one or more portions of a component, printing a cooling member of the component, and attaching one or more portions to the cooling member of the component. The cooling member includes one or more cooling functions. One or more cooling functions include one or more cooling channels which approach a surface of the component, and the cooling member in which one or more cooling channels are arranged within a range of approximately 127 μm (0.005 inch) to approximately 762 μm (0.030 inch) from the surface of the component can be made in a near net shape by printing. The heat management method also includes cooling the component by sending fluid by one or more fluid passages which are formed by one or more cooling channels in the component.
申请公布号 JP2015067902(A) 申请公布日期 2015.04.13
申请号 JP20140192076 申请日期 2014.09.22
申请人 GENERAL ELECTRIC CO <GE> 发明人 KOTTILINGAM SRIKANTH CHANDRUDU;LACY BENJAMIN PAUL;MIRANDA CARLOS MIGUEL;DAVID EDWARD SCHICK
分类号 C23C6/00;B22F3/105;B22F3/16;B23K1/00;B23K9/00;B23K20/00;C23C4/12;F01D5/18;F01D5/28;F01D9/02;F01D25/00;F01D25/12;F02C7/00;F02C7/18;F28F21/08 主分类号 C23C6/00
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