| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device suitable for downsizing.SOLUTION: The semiconductor device includes: a power amplifier 16 for amplifying an RF signal over a plurality of frequency bands; an output matching circuit 18 connected to an output of the power amplifier; a first capacitor 30 with one end connected to an output of the output matching circuit; a plurality of output paths 34; a switch 32 connected to the other end of the first capacitor to route the RF signal to any one of the plurality of output paths in accordance with a frequency band thereof; and a plurality of second capacitors 40 having second capacitors connected in series in the plurality of output paths, respectively. At least one of the first capacitor and the plurality of second capacitors and the switch are constituted in the same MMIC 46.</p> |
