METHOD FOR MANUFACTURING FLEXIBLE WIRING BOARD, AND APPARATUS FOR FORMING SOLDER RESIST FILM TO BE USED FOR THE METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a flexible wiring board and an apparatus for forming a solder resist layer, in which a bleeding amount of a liquid solder resist can be minimized even in a fine wiring line.SOLUTION: A liquid solder resist 3 extruded from a screen mask 2 is applied on a substrate material 1. After applying the liquid solder resist 3, the substrate material is subjected to air blow by a wind blown from a nozzle 8. This promotes volatilization of a solvent in an outer periphery of the liquid solder resist and suppresses bleeding of the liquid solder resist.