| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device and a mounting method of the semiconductor device, which can inhibit breakage of a probe in wafer testing and breakage of a pad in wire bonding.SOLUTION: A semiconductor device comprises: a source terminal electrode 3 in which a wire bonding region 39 is formed thicker than a probe contact region 36; and a drain terminal electrode 4 in which a wire bonding region 40 is formed thicker than a probe contact region 37 similarly.</p> |
