发明名称 HEAT-EXPANDABLE MICROCAPSULES
摘要 <p>PROBLEM TO BE SOLVED: To provide heat-expandable microcapsules which, when used in foam molding, hardly generate coloration and an offensive odor while keeping a high expansion ratio and high-temperature durability, a heat-expandable thermoplastic resin masterbatch using the heat-expandable microcapsules, a foam-molded article, and a method for producing the heat-expandable microcapsules.SOLUTION: Provided are heat-expandable microcapsules having a volatile expansion agent included as a core agent in a shell comprising a polymer. The shell comprises: a polymer formed by polymerizing a monomer composition comprising a nitrile-based monomer and a hydroxyl group-containing monomer containing a radically polymerizable double bond and a hydroxyl group; and a polyfunctional reactive compound having two or more functional groups in a molecule, which are reactive with the hydroxyl group, and no radically polymerizable double bond.</p>
申请公布号 JP2015067623(A) 申请公布日期 2015.04.13
申请号 JP20130200204 申请日期 2013.09.26
申请人 SEKISUI CHEM CO LTD;TOKUYAMA SEKISUI IND CORP 发明人 YAMAUCHI HIROSHI;MORITA HIROYUKI;WADA YASUKO
分类号 C09K3/00;B01J13/04;C08J9/32 主分类号 C09K3/00
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