发明名称 EPOXY RESIN, EPOXY RESIN COMPOSITION, PREPREG AND CURED PRODUCT THEREOF
摘要 <p>PROBLEM TO BE SOLVED: To provide a high purity epoxy resin containing a mesogenic group, which can make an uniformly cured product and has high thermal conductance.SOLUTION: An epoxy resin mixture contains an epoxy resin obtained through the steps (A) to (B), where the total area ratio of a specific epoxy compound in GPC is in a specific range and 3.1 to 20 area% of the resin represented by the formula (3) is contained. Step (A): a specific hydroxyacetophenone-based compound and a specific hydroxybenzaldehyde compound are reacted to obtain a phenolic compound (a). Step (B): the phenolic compound (a) obtained in the step (A) is reacted with epihalohydrin by a known technique to obtain an epoxy resin.</p>
申请公布号 JP2015067830(A) 申请公布日期 2015.04.13
申请号 JP20130206439 申请日期 2013.10.01
申请人 NIPPON KAYAKU CO LTD 发明人 HASEGAWA ATSUHIKO;KAWAI KOICHI;NAKANISHI MASATAKA
分类号 C08G59/04;C08J5/24;C08L63/00 主分类号 C08G59/04
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