| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a polymerizable composition, a crosslinkable resin molded body, a crosslinked resin molded body and a laminate for manufacturing a dielectric layer of electronic devices excellent in peel strength, heat resistance and crack resistance.SOLUTION: There are provided a polymerizable composition containing a monomer mixture containing alicyclic monoolefin ester represented by the formula (1) having purity of 97 mass% or more (A) and an alicyclic olefin monomer (B) (excluding alicyclic monoolefin ester (A)), a metathesis polymerization catalyst and a crosslinking agent, a crosslinkable resin molded body obtained by a bulk polymerization reaction of the polymerizable composition, a crosslinked resin molded body by crosslinking the crosslinkable resin molded body and a laminate by laminating the crosslinkable resin molded body and the crosslinked resin molded body.</p> |
