| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition which has sufficient heat treatment, provide a hardened production excellent in adhesiveness to metals, especially copper, nickel and their alloys and is also sufficient in usable life and a sealing material and a semiconductor device using it.SOLUTION: A curable resin composition comprises (A) an epoxy resin, (B) a hardening agent and (C) an aromatic amide compound, and the aromatic amide compound is a compound having a hydroxy-containing aromatic ring and an amide bond. |
