发明名称 HEAT RELEASE SHEET
摘要 PROBLEM TO BE SOLVED: To provide a heat release sheet excellent in thermal conductivity and comprehensively in cold heat resistance and moist heat resistance, and capable of being used not only for fixing and heat releasing lighting devices using light emission diode (LED), electroluminescence, lighting devices for backlight, solar cells, cells such as lithium ion battery, computer components such as IC and CPU, electrical power controllers such as modules, power supply circuits such as inverters, touch panels, electromagnetic shields, components in electronic devices required to be thin and used for smart phones, tablet terminals, wireless power supplies or the like, but also for graphite sheets, metallic foils, processed products thereof or the like.SOLUTION: There is provided a heat release sheet containing heat release material containing an adhesive resin, an inorganic filler and a curing agent.
申请公布号 JP2015067713(A) 申请公布日期 2015.04.13
申请号 JP20130202827 申请日期 2013.09.28
申请人 NIPPON SHOKUBAI CO LTD 发明人 SAKAMOTO YOSHIMINE
分类号 C08L101/14;C08K3/00;C09J7/02;C09J11/04;C09J201/00;C09K5/08;H01L23/36;H01L33/64;H05K7/20 主分类号 C08L101/14
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