PARTING METHOD OF WAFER LAMINATE FOR IMAGE SENSOR, AND PARTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a parting method of a wafer laminate for an image sensor and a parting device of the wafer laminate for the image sensor, by and with which the wafer laminate can be parted effectively and finely according to a dry-system simple technique without using a dicing saw.SOLUTION: A wafer laminate W for an image sensor is structured by bonding a glass wafer 1 and a silicon wafer 2 with a resin layer 4 which is disposed so as to surround photodiode formation regions 3. The parting method of the wafer laminate W for the image sensor includes: forming a scribe line S1 by pressing/rolling a scribing wheel 10 along a predetermined parting line on a top face of the glass wafer 1; next forming a scribe line S2 by pressing/rolling a diamond point cutter 25 including a protrusive blade point 25b at a tip of a blade body 25a, along a predetermined parting line on an outer surface of the silicon wafer 2; and then bending the wafer laminate W by pressing it with a pressing member 14 from the outer surface side of the silicon wafer 2 along the scribe line S2, such that the glass wafer 1 and the silicon wafer 2 are parted.