| 摘要 |
PROBLEM TO BE SOLVED: To provide a package carrier capable of carrying a chip, and a manufacturing method of the package carrier.SOLUTION: There is provided a manufacturing method of a package carrier. In the method, firstly, two base metal layers are bonded together and then two supporting layers are laminated onto the base metal layers respectively; next, two release metal layers are disposed on the supporting layers respectively, each release metal layer including a first metal foil and a second metal foil separable from each other; next, two patterned metal layers are formed on the supporting layers respectively, each patterned metal layer being suitable for carrying a chip to be electrically connected to the chip; and the base metal layers are separated from each other to form two independent package carriers. |
