摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer substrate capable of preventing peeling from occurring at an interface of a conductive member arranged inside a substrate body.SOLUTION: A multilayer substrate 10 includes a substrate body 11 having first and second principal surfaces 11a, 11b which face each other, and conductive members 14a, 14b arranged inside the substrate body 11. The substrate body 11 includes: (a) first and second insulation layers 12a, 12b which form the first and second principal surfaces 11a, 11b, respectively; and (b) an insulator layer 13 which is arranged between the first insulation layer 12a and the second insulation layer 12b and is formed of resin or rubber. The conductive members 14a, 14b are arranged inside the insulator layer 13 with a space from the first and second insulation layers 12a, 12b, and are in contact with the insulator layer 13. The insulator layer 13 has an elastic modulus smaller than an elastic modulus of the first insulation layer 12a and smaller than an elastic modulus of the second insulation layer 12b.</p> |