| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing conductive particles having metal layers uniformly formed on the surfaces of particles to be deposited by a spattering method without generating aggregation or film peeling.SOLUTION: A method of manufacturing composite conductive particles comprises sputtering a sputtering target 13 to form metal layers on the surfaces of particles 21 to be deposited while vibrating a vessel 14 arranging the mixture of the particles 21 to be deposited and agitation balls 22. The thickness A of the laminate layer 19 of the mixture and the diameter B of the agitation ball 22 satisfy the formula of 0.1≤A/B≤1, and the diameter B is 1 mm or more and 10 mm or less. One or more ground layers of metal selected a group consisting of Ni, Cu, Ag, Au, Pt, Pa and Ru are formed on the surface of a particle body consisting of the resin particle.</p> |
