| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a thermal head in which current resistance of an electrode layer is improved and furthermore adhesiveness of the electrode layer to a bonding wire is improved.SOLUTION: The thermal head comprises: a first electrode layer 28 which is constituted of an aluminum-copper alloy, formed on a top face of a heat element, and causes the heat element to generate heat by flowing current therein; a protective layer 29 which is formed on the top faces of the heat element and the first electrode layer, and in which an opening is formed at a part adjacent to a circuit board; a second electrode layer 25 which is constituted of aluminum with less content of copper than that of the first electrode layer or without containing copper, and formed so as to be exposed to the outside at the top face of the first electrode layer, a drive IC which is mounted on the circuit board, and drives the heat element; and a bonding wire which connects the second electrode layer with the drive IC.</p> |
