发明名称 RESIN APPLICATOR AND RESIN APPLICATION METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a resin applicator capable of ensuring applying a resin onto a plate element with a uniform film thickness even if disturbance occurs.SOLUTION: A parameter storage unit 234 stores a correction data table. The correction data table stores various parameters suitable for applying a UV curable resin onto an application target area with a uniform film thickness using a reference resin that is a UV curable resin in a predetermined relation between a viscosity and a temperature, per predetermined unit temperature of the reference resin. A control unit 230a estimates a viscosity of a used resin in response to a temperature of the used resin detected by a temperature sensor 232. Furthermore, the control unit 230a identifies a temperature corresponding to the viscosity of the reference resin approximate to the estimated viscosity of the used resin, and acquires parameters while referring to the correction data table on the basis of the identified temperature.</p>
申请公布号 JP2015066530(A) 申请公布日期 2015.04.13
申请号 JP20130205221 申请日期 2013.09.30
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 ARAKI MASAKI;SATO KAZUNARI
分类号 B05C11/10;B05C11/00;B05D1/26;B05D7/24 主分类号 B05C11/10
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