| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device in which an optical semiconductor element is resin encapsulated by a potting method and which is excellent in stability of light distribution characteristics at a low cost.SOLUTION: In an optical semiconductor device, as means for inhibiting broadening of a bottom face of an encapsulation resin part which covers an optical semiconductor element as a coating layer, a dam is formed by using a die bond material simultaneously with a die bonding process. |
