发明名称 |
SUBSTRATE BONDING APPARATUS |
摘要 |
<p>PROBLEM TO BE SOLVED: To appropriately transport a substrate with attachments.SOLUTION: A transport support unit 212b includes a bracket 213 and a support unit main body 214. The bracket 213 is a member formed into a generally L-shape to include a bottom surface 215 formed into a rectangular shape and a side surface 216 bent vertically from one end of a transport arm 210b in a short length direction thereof and extending upward. The support unit main body 214 extends from an upper end of the side surface 216 in a direction orthogonal to an extension direction of (vertical direction to) the side surface 216 toward an adjacent transport arm 210c. The transport support unit 212b contacts a generally central portion of an FPC 124a in an extension direction thereof and supports the FPC 124a.</p> |
申请公布号 |
JP2015069106(A) |
申请公布日期 |
2015.04.13 |
申请号 |
JP20130204778 |
申请日期 |
2013.09.30 |
申请人 |
HITACHI HIGH-TECH FINE SYSTEMS CORP |
发明人 |
MIURA KOICHIRO |
分类号 |
G09F9/00;B65G49/06;G02F1/13;G02F1/1333;H01L21/677 |
主分类号 |
G09F9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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