发明名称 SUBSTRATE BONDING APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To appropriately transport a substrate with attachments.SOLUTION: A transport support unit 212b includes a bracket 213 and a support unit main body 214. The bracket 213 is a member formed into a generally L-shape to include a bottom surface 215 formed into a rectangular shape and a side surface 216 bent vertically from one end of a transport arm 210b in a short length direction thereof and extending upward. The support unit main body 214 extends from an upper end of the side surface 216 in a direction orthogonal to an extension direction of (vertical direction to) the side surface 216 toward an adjacent transport arm 210c. The transport support unit 212b contacts a generally central portion of an FPC 124a in an extension direction thereof and supports the FPC 124a.</p>
申请公布号 JP2015069106(A) 申请公布日期 2015.04.13
申请号 JP20130204778 申请日期 2013.09.30
申请人 HITACHI HIGH-TECH FINE SYSTEMS CORP 发明人 MIURA KOICHIRO
分类号 G09F9/00;B65G49/06;G02F1/13;G02F1/1333;H01L21/677 主分类号 G09F9/00
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