发明名称 EPOXY RESIN, EPOXY RESIN COMPOSITION, PREPREG AND THEIR CURED PRODUCT
摘要 <p>PROBLEM TO BE SOLVED: To provide an epoxy resin having high thermal conductivity and a cured product thereof.SOLUTION: An epoxy resin is obtained through the following steps (A) to (B). Step (A): the formula (1) and a hydroxybenzaldehyde having a specific structure are reacted to obtain a phenolic compound (a). Step (B): the phenolic compound (a) obtained in the step (A) is reacted with epihalohydrin to obtain an epoxy resin. An epoxy resin composition comprises an epoxy resin, a curing agent and/or a curing accelerator, and an inorganic filler having a thermal conductivity ratio of 20 W/m.K or more.</p>
申请公布号 JP2015067831(A) 申请公布日期 2015.04.13
申请号 JP20130206440 申请日期 2013.10.01
申请人 NIPPON KAYAKU CO LTD 发明人 HASEGAWA ATSUHIKO;KAWAI KOICHI;NAKANISHI MASATAKA
分类号 C08G59/08;C08G59/20;C08J5/24;C08K3/00;C08L63/00;H01L23/29;H01L23/31 主分类号 C08G59/08
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