发明名称 |
EPOXY RESIN, EPOXY RESIN COMPOSITION, PREPREG AND THEIR CURED PRODUCT |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide an epoxy resin having high thermal conductivity and a cured product thereof.SOLUTION: An epoxy resin is obtained through the following steps (A) to (B). Step (A): the formula (1) and a hydroxybenzaldehyde having a specific structure are reacted to obtain a phenolic compound (a). Step (B): the phenolic compound (a) obtained in the step (A) is reacted with epihalohydrin to obtain an epoxy resin. An epoxy resin composition comprises an epoxy resin, a curing agent and/or a curing accelerator, and an inorganic filler having a thermal conductivity ratio of 20 W/m.K or more.</p> |
申请公布号 |
JP2015067831(A) |
申请公布日期 |
2015.04.13 |
申请号 |
JP20130206440 |
申请日期 |
2013.10.01 |
申请人 |
NIPPON KAYAKU CO LTD |
发明人 |
HASEGAWA ATSUHIKO;KAWAI KOICHI;NAKANISHI MASATAKA |
分类号 |
C08G59/08;C08G59/20;C08J5/24;C08K3/00;C08L63/00;H01L23/29;H01L23/31 |
主分类号 |
C08G59/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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