| 摘要 |
PROBLEM TO BE SOLVED: To provide a case for electronic component of novel structure which allows for cost reduction while coping with thinning and weight reduction.SOLUTION: A case for electronic component includes a lower case 10 including a bottom plate 11, a sidewall 12 having a protrusion P, an engaging protrusion 14 formed on the outer surface of the sidewall, and a screw hole 15 formed in the sidewall 12 of a region provided with the protrusion P, and an upper case 20 including a top plate 21, a sidewall 22 in which an engaging hole 24 is formed, and a notch 25a formed in the sidewall 22 on the top plate 21 side. The protrusion P of the lower case 10 engages with the notch 25a of the upper case 10, the screw hole 15 is exposed from the notch 25a, and the engaging protrusion 14 of the lower case 10 engages with the engaging hole 24 of the upper case 20. |
