| 摘要 |
<p>The light emitting device package according to an embodiment comprises: a body having a cavity; a plurality of lead frames including first and second lead frames placed in the bottom of the cavity; a first protection portion which protrudes beyond the surface of the body from the first side of the body, and projects from the first lead frame, wherein at least a portion of the first lead portion protruding more than the first protection portion from the first side of the body; a second protective portion protruding than the side of the body from the second side of the body, and protruding from the second lead frame, wherein at least a portion of the second lead portion protruding more than the second protection portion from the second side of the body; a light emitting chip disposed on the lead frame, at least one of the plurality of lead frames; and a molding member molded in the light emitting chip and formed in the cavity.</p> |
