半导体装置,申请号TW102121680-传众专利搜索

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法人/股东/高管

发明名称	半导体装置
摘要
申请公布号	TWI480983	申请公布日期	2015.04.11
申请号	TW102121680	申请日期	2013.06.19
申请人	三菱电机股份有限公司	发明人	野上洋一;山本佳嗣;井上晃;横山吉典;藤田淳;远藤加寿代;曾田真之介;西川和康
分类号	H01L23/02;H01L23/60	主分类号	H01L23/02
代理机构		代理人	洪澄文台北市南港区三重路19之6号2楼
主权项	一种半导体装置，包括：基板；半导体元件，配置于上述基板上；配线，配置于上述基板上，电性连接上述半导体元件；窗框部，配置于上述基板上，围绕上述半导体元件，接触上述配线；以及封合窗，接合上述窗框部，封合上述半导体元件；其中，上述窗框部系具有106~1010Ω/□的片电阻之低融点玻璃。
地址	日本

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