| 发明名称 |
SOLDER COMPOSITIONS |
| 摘要 |
<p>A solder composition comprising a blend of a first powder component and a second powder component wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.</p> |
| 申请公布号 |
IN939CHN2014(A) |
申请公布日期 |
2015.04.10 |
| 申请号 |
IN2014CH00939 |
申请日期 |
2014.02.05 |
| 申请人 |
ALPHA METALS INC. |
发明人 |
DE AVILA RIBAS MORGANA;LODGE DOMINIC;PANDHER RANJIT;SINGH BAWA;BHATKAL RAVINDRA M;RAUT RAHUL;SARKAR SIULI;CHATTOPADHYAY KAMANIO;NANDI PROLOY |
| 分类号 |
B23K35/02;B23K35/26;B23K35/30 |
主分类号 |
B23K35/02 |
| 代理机构 |
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代理人 |
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