| 摘要 |
<p>The present invention relates to an etching composition to enable a stable etching process by preventing an undercut on molybdenum or a molybdenum containing film in the etching process of a copper and molybdenum containing film, thereby improving etching properties on tapering angles, CD loss, and etching linearity. The etching composition is composed of 10-30 wt% of hydrogen peroxide, 0.1-5 wt% of an etching inhibitor, 0.1-5 wt% of a chelating agent, 0.1-5 wt% of an etching additive, 0.01-2 wt% of a fluorine compound, 0.01-2 wt% of an undercut inhibitor, and remaining amount of water based on the total weight of the composition.</p> |
