| 摘要 |
<p>The present invention relates to a metal wire structure with a reliable bonding structure, an integrated circuit, an integrated circuit package using the same, and manufacturing methods thereof. According to one embodiment of the present invention, provided is the integrated circuit which is electrically and mechanically connected by a current assisted bonding. A first integrated circuit of a circuit module comprising the integrated circuit includes a first metal wire structure with a first bonding surface which is exposed on at least one side thereof. A second integrated circuit includes a second metal wire structure with a second bonding surface which is exposed on at least one side thereof. The first bonding surface is directly bonded to the second bonding surface by the current assisted bonding.</p> |
