SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

A semiconductor device includes a carrier, several dies disposed on a surface of the carrier and several scribing lines defined on the surface of the carrier. The scribing lines include several continuous lines along a first direction and several discontinuous lines along a second direction. Further, a method of dies singulation includes providing a carrier, disposing several dies on a surface of the carrier according to several scribing lines including several continuous lines along a first direction and several discontinuous lines along a second direction, cutting the carrier according to the continuous lines along the first direction, and cutting the carrier according to the discontinuous lines along the second direction.

主权项

1. A semiconductor device, comprising:
a carrier; a plurality of dies disposed on a surface of the carrier; a plurality of scribing lines defined on the surface of the carrier; wherein the plurality of scribing lines include a plurality of continuous lines along a first direction and a plurality of discontinuous lines along a second direction.