| 摘要 |
<p>A driving chip includes at least one driving integrated circuit, a base substrate which includes a plurality of metal wires and a passivation layer which covers the metal wires and the driving integrated circuits, a plurality of input bumps which are arranged near a first barrier of the base substrate, a plurality of output bumps which are arranged near a second barrier of the base substrate, and a plurality of dummy bumps with an island structure which are arranged in the center region of the base substrate between the input bumps and the output bumps. The dummy bumps have a stack structure which is different from the input bumps and the output bumps.</p> |
