发明名称 CO-EXTRUSION T DIE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a co-extrusion T die device which allows temperature control of a multi-layer molten film immediately after discharge from the die for each resin layer by measuring a distribution in the die width direction (longitudinal direction) of temperatures of the individual resin layers of a multi-layer molten film discharged from the tip of a T die lip of a co-extrusion T die apparatus and feedbacks the temperature data to a resin extrusion machine and a heater provided in the T die so as to control temperature.SOLUTION: In a co-extrusion T die device, temperature control means 9 controls the temperatures of heaters 11-1a and 11-1b on the basis of temperature measurements obtained by temperature measurement means 8 so as to control the temperature in the width direction for each resin species of a multi-layer molten film R2.
申请公布号 JP2015063105(A) 申请公布日期 2015.04.09
申请号 JP20130199645 申请日期 2013.09.26
申请人 TOPPAN PRINTING CO LTD 发明人 YAMADA AKITSUGU
分类号 B29C47/06;B29C47/78;B29C47/92 主分类号 B29C47/06
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